| 摘要 |
PROBLEM TO BE SOLVED: To provide a heating and cooling device for a semiconductor element test handler capable of surely adjusting a desired temperature condition of high temperature and low temperature, of a semiconductor element with a simple constitution. SOLUTION: This device comprises a heat conductive loading plate 3 provided with two or more loading parts for loading the semiconductor element, a heat conductive heating plate 2 connected to a lower part of the loading plate, provided with at least one or more heaters inside thereof, and conducting the predetermined heat to the loading plate, a heat conductive cooling plate 1 connected to a lower part of the heating plate on a main body of the handler, and provided with a flowing groove for allowing the cooling fluid supplied from an external cooling fluid supply source to flow, and then to be discharged to the outside, heating control means 7, 8 adjusting the heat released from the heaters of the heating plate for adjusting a heating temperature of the loading plate, and a cooling control means 6 for adjusting the amount of cooling fluid supplied to the cooling plate to adjust a cooling temperature of the loading plate. COPYRIGHT: (C)2003,JPO
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