| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which excels in electrical insulation properties as in the conventional one, has a short period of sealing time, and can inhibit voids and sink marks to be generated during its process in the area amounting method which seals a semiconductor chip, particularly a semiconductor chip having a protruding electrode on the circuit surface. SOLUTION: The liquid resin composition comprises (A) an epoxy resin having at least two epoxy groups, (B) a compound having an fluxing action, and at least two phenolic hydroxyl groups per molecule and at least one carboxylic acid group per molecule, and (C) a curing agent, the particle diameter or the length of (B) the compound having at least two phenolic hydroxyl groups per molecule and at least one carboxylic acid group per molecule being a maximum of≤30μm. COPYRIGHT: (C)2003,JPO
|
