| 发明名称 |
RESIN COMPOSITION FOR SEALING SEMICONDUCTOR, SEMICONDUCTOR APPARATUS USING THE SAME, AND MANUFACTURING METHOD THEREFOR |
| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition for sealing a semiconductor that has excellent flow characteristics as well as excellent flame retardance and moisture resistance reliability. SOLUTION: This resin composition for sealing a semiconductor comprises (a) a thermosetting resin, (b) a curing agent, (c) a polyhedral compound metal hydroxide represented by general formula (1): Mg<SB>1-</SB>XZnX(OH)<SB>2</SB>(wherein X is a positive number of 0.01-0.5), and (d) a spherical silica powder. COPYRIGHT: (C)2003,JPO
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| 申请公布号 |
JP2003192907(A) |
申请公布日期 |
2003.07.09 |
| 申请号 |
JP20010396134 |
申请日期 |
2001.12.27 |
| 申请人 |
NITTO DENKO CORP |
发明人 |
NISHIOKA TSUTOMU;IKEMURA KAZUHIRO;YAMAGUCHI YOSHIO |
| 分类号 |
C08L101/00;C08G59/62;C08K3/24;C08K3/36;C08K5/00;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08L101/00 |
主分类号 |
C08L101/00 |
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