| 摘要 |
PROBLEM TO BE SOLVED: To provide a flame-retardant epoxy resin composition which excels in flame retardance without containing a halogen compound and, simultaneously, excels in heat resistance, adhesion, and insulating properties, its molded product, and a multi- layer printed-wiring board using the same. SOLUTION: The flame-retardant epoxy resin composition has (A) a resin having at least two epoxy groups in the molecule, (B) an epoxy resin curing agent, and (C) a cycloalkylene phosphine derivative to be represented by formula (1) (wherein R<SB>1</SB>is a cycloalkylene group; and X is an oxygen atom or a sulfur atom) or formula (2) (wherein R<SB>1</SB>and X are the same as defined above) as the essential components. The molded product is obtained by impregnating a substrate with this composition as such or after having been turned into a varnish and drying the impregnated substrate or the molded product is obtained by coating this composition as such or after having been turned into a varnish on a support film and drying the coated support film. The multi-layer printed-wiring board is obtained by laminating a molded product obtained by coating the composition as such or after having been turned into a vanish on a copper foil and drying the coated copper foil, and effecting heat curing. COPYRIGHT: (C)2003,JPO |
