| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly thermo resistant and highly heat dissipation adhesive film capable of thermocompression bonding and curing at a low temperature and a low pressure when compared with conventional materials as an adhesive material for electronic parts and semiconductor parts, and excellent in processability (punching and cutting) in semi-cured state, and excellent in adhesive property to an uneven surface such as that processed for circuit (circuit embedding property) in cured and semi-cured state and manifesting excellent heat dissipation and heat resistance even when curing. SOLUTION: The highly thermo resistant and heat dissipation adhesive film in semi-cured state is obtained by heat-treating an adhesive composition comprising 100 pts.wt. of an epoxy resin and a curing agent, 160-240 pts.wt. of a siloxane modified polyamide imide component, 80-160 pts.wt. of a rubber component having a weight average molecular weight of≥50,000, 40-80 pts.vol. of an inorganic filler and 0.4-4.0 pts.wt. of a curing accelerator, to have a curing rate of 30-60%. COPYRIGHT: (C)2003,JPO
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