METHOD FOR REMOVING DAMAGED SUBSTRATE REGION BENEATH COATING

摘要

PROBLEM TO BE SOLVED: To provide a method for removing only a damaged layer without removing a undamaged region of a substrate. SOLUTION: According to the method that the damaged surface layer beneath the coating on a component, the component is inspected in order to evaluate a depth of the damaged substrate layer and a plurality of points over an outer surface of the component are detected in order to determine a three-dimensional outer surface profile. A three-dimensional grinding profile beneath the outer surface profile is established based on the depth of the damaged substrate layer beneath the outer surface profile. The component is ground along the grinding profile such that the damaged substrate layer is substantially removed without significantly removing the undamaged region of the substrate beneath the damaged substrate layer. COPYRIGHT: (C)2003,JPO