| 摘要 |
A layout structure of a semiconductor memory device having a memory cell array region, a word line drive region proximate the memory cell array, a bit line equalization region spaced apart from the memory cell array region, an impurity region formed between the memory cell array region and the bit line equalization region electrically coupled to the bit line equalization region, and a metal line supplying a bit line equalization voltage to the impurity region, wherein a contact connecting the metal line and the impurity region is formed lateral to the word line drive region rather than between the memory cell array region and the bit line equalization region, so that no contacts are formed directly between the memory cell array region and the bit line equalization region.
|
