| 摘要 |
A nonvolatile semiconductor memory device, wherein a poly-silicon film is formed on the entire surface of a memory cell region and a peripheral circuit region, and the poly-silicon film on an element isolating insulation film between the gate insulation films of the memory cell region is selectively removed to form a floating gate base layer. Subsequently, an ONO film is formed on the entire surface, and the poly-silicon film and the ONO film is removed from the peripheral circuit region. A conductive film is then formed on the entire surface, a control gate and a floating gate patterned, and a gate electrode then patterned, although at this point, the ONO film and the poly-silicon film are removed from a boundary region, and when the gate electrode is formed, the element isolating insulation film is carved out and a groove is formed in the region where the conductive film is removed by etching.
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