Electrostatic coating of moldings with thermoplastic and crosslinkable copolyamide hot-melt adhesives

摘要

A process is described in which a nonconductive molding is electrostatically coated with a thermoplastic or crosslinkable copolyamide hot-melt adhesive. The hot-melt adhesive may be used as a fine powder with a particle size between 1 and 200 mum and have a melting point up to 160° C.