DEVICE AND METHOD OF LASER MARKING

摘要

PROBLEM TO BE SOLVED: To reduce the lowering of product yield caused by foreign maters occurring at a marking process.

SOLUTION: A conductive plate 20 is arranged in the vicinity of a location which is irradiated with a laser 12 in a marking region of a silicone wafer 100. The conductive plate 20 has a slit 21 over which the laser 12 passes without coming to a contact and is arranged in a way that the silicone wafer 100 is irradiated with the laser 12 through the slit 21. A potential difference supplying part 30 is provided with a power source 31 and a conductive stage 32, and the power source 31 applies a potential difference V between the stage 32 and the conductive plate 20.

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