发明名称 Temperature sensor with flexible circuit substrate
摘要 A temperature sensor incorporating flexible circuit technology. A flexible circuit sensor subassembly is composed of a flexible printed circuit substrate on which is printed a sensor circuit. In a preferred example the flexible circuit sensor subassembly, the sensor circuit has a sensor at a distal end, as for example a surface mount device (SMD) thermistor, a plurality of trace pads at a proximate end, and an interconnecting conductive trace between each trace pad and the sensor. A crimp terminal is respectively crimped onto each trace pad to provide a flexible circuit sensor assembly, wherein the crimp terminals are configured as needed for interfacing with an external circuit. The location of the sensor may be selectively located anywhere on the conductive traces to thereby easily size the probe length of the flexible circuit sensor subassembly to suit a any particular application and fit into any housing. A housing id molded over the flexible circuit sensor assembly. The housing either alone or located in an external shell provides a temperature sensor for a particular purpose. In a variation of the flexible circuit sensor assembly, electronic components can be integrated with the sensor circuit to provide a smart sensor circuit, which may include multiple sensing devices.
申请公布号 US6588931(B2) 申请公布日期 2003.07.08
申请号 US20000732287 申请日期 2000.12.07
申请人 DELPHI TECHNOLOGIES, INC. 发明人 BETZNER TIMOTHY M.;O'CONNELL DAVID P.;STRAUB PETER J.;BOEHM MICHAEL J.
分类号 G01K7/22;(IPC1-7):G01K7/00;G01K1/16 主分类号 G01K7/22
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