发明名称 |
Stacked semiconductor package formed on a substrate and method for fabrication |
摘要 |
A stacked semiconductor package formed on a substrate arranged in a serpentine configuration and a method for such fabrication are disclosed. The package is formed by at least one substrate section formed on the substrate bonded to at least one IC die by a flip-chip bonding method. The substrate is then folded onto itself such that the backside of a first IC die is adhesively bonded to the backside of a second IC die. A heat sink may optionally be utilized in-between the IC dies during the adhesive bonding process to further enhance thermal dissipation. The substrate section may be bonded to a printed circuit board by a plurality of solder balls formed on an active surface of the substrate section. The present invention can be bonded to a printed circuit board either in a horizontal position or in a vertical position for saving more real-estate on the board.
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申请公布号 |
US6590282(B1) |
申请公布日期 |
2003.07.08 |
申请号 |
US20020038232 |
申请日期 |
2002.04.12 |
申请人 |
INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE |
发明人 |
WANG HSING-SENG;LEE RONG-SHEN;WANG CHIA-CHUNG |
分类号 |
H01L25/065;(IPC1-7):H01L23/02 |
主分类号 |
H01L25/065 |
代理机构 |
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主权项 |
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地址 |
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