| 摘要 |
A process for treating a conductor winding component of a dynamoelectric device incorporates a cryogenic cycle having a ramp down phase during which the conductor winding component is ramped down from at least about -100° F. in a dry cryogenic environment to about -300° F. over several hours, preferably greater than five (5) hours and including seven (7) hours or more, followed by a cryogenic hold phase during which the conductor winding component is held at about -300° F. over an additional several hours, preferably greater than twenty-four (24) hours and including thirty-six (36) hours or more, followed by a cryogenic ramp up phase during which the conductor winding component is ramped up to about -200° F. over another several hours, preferably greater than twelve (12) hours and including eighteen (18) hours or more.
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