Process for manufacturing molded circuit board

摘要

A molded circuit board is formed by a process comprising the steps of: molding liquid crystal polymer of plating grade into a primary molded member which outline corresponds to the dimensions of the molded circuit board; roughening the surface of the primary molded member; molding a secondary molded member by coating the primary molded member with oxyalkylene-containing poly(vinyl alcohol) resin over the surface thereof except for a portion thereof on which a circuit is to be formed; heating the first and secondary molded members; applying catalyst to the portion of the surface of the primary molded member not covered by the secondary molded member; heating the first and secondary molded members in hot water to elute the secondary molded member; and chemically plating the catalyst-applied-portion to form the circuit thereon, by which the size of the molded circuit board is minimized with simple procedures and production cost reduced.