| 摘要 |
A packaging structure and a packaging method reworkable even after the formal curing and good in connection reliability, characterized in that an electrode 8 of a semiconductor device 6 and an electrode 7 of a substrate 1 are electrically connected via bumps 5, a first resin 3 decreasing in mechanical strength and becoming reworkable under given conditions and a second resin 4 capable of mitigating the stress due to a difference in thermal expansion coefficient between the semiconductor device 6 and the substrate 1 and superior in mechanical strength to the first resin under the given conditions are stacked and formed in the gap between the semiconductor device 6 and the substrate 1 and moreover the first resin 3 is formed at a thickness of less than a half of said gap in total on the surface of at least either of the semiconductor device 6 and the substrate 1.
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