发明名称 POLYIMIDE FILM AND LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a polyimide film wherein the etching time is short in forming a pattern by chemical etching and to provide a laminate. SOLUTION: The polyimide film of≥3.0μm/min in chemical etching speed as the whole of the film is provided by stacking a polyimide layer for a surface modifying layer on at least one side surface of the polyimide layer comprising a pyromellitic acid dianhydride residue and 3,3',4,4'-biphenyltetracarbonate dianhydride residue as a tetracarbonate component for a substrate layer, and a p-phenylenediamine residue and 4,4'-diaminophenyl ether residue as a diamine component. Then, the laminate is provided by stacking an electrically conductive metallic layer on the polyimide film. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003191412(A) 申请公布日期 2003.07.08
申请号 JP20010391387 申请日期 2001.12.25
申请人 UBE IND LTD 发明人 OZAWA HIDEO;YAMAMOTO SHIGERU
分类号 B32B27/34;C08G73/10;(IPC1-7):B32B27/34 主分类号 B32B27/34
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