发明名称 Liquid cooled circuit device and a manufacturing method thereof
摘要 A liquid-cooled circuit device including: a module having a circuit element and a module base plate on surface of which the circuit element is mounted; a circuit case for accommodating the module; and a cooling liquid chamber for flowing a cooling liquid in contact with a back face of the module base plate of said module. The module base plate of the module is fitted into an opening provided in a member forming the cooling liquid chamber and welded without a gap.
申请公布号 US6588647(B2) 申请公布日期 2003.07.08
申请号 US20020228295 申请日期 2002.08.27
申请人 HITACHI, LTD. 发明人 YAMADA KAZUJI;TAMBA AKIHIRO;NAKAMURA TAKAYOSHI;SAITO RYUICHI;OGAWA TOSHIO;OKAMURA HISANORI
分类号 B23K20/12;B23K101/14;H01L23/40;H01L23/473;H01L25/11;H05K7/20;(IPC1-7):B23K20/12;B23K31/02 主分类号 B23K20/12
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