发明名称 |
Liquid cooled circuit device and a manufacturing method thereof |
摘要 |
A liquid-cooled circuit device including: a module having a circuit element and a module base plate on surface of which the circuit element is mounted; a circuit case for accommodating the module; and a cooling liquid chamber for flowing a cooling liquid in contact with a back face of the module base plate of said module. The module base plate of the module is fitted into an opening provided in a member forming the cooling liquid chamber and welded without a gap.
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申请公布号 |
US6588647(B2) |
申请公布日期 |
2003.07.08 |
申请号 |
US20020228295 |
申请日期 |
2002.08.27 |
申请人 |
HITACHI, LTD. |
发明人 |
YAMADA KAZUJI;TAMBA AKIHIRO;NAKAMURA TAKAYOSHI;SAITO RYUICHI;OGAWA TOSHIO;OKAMURA HISANORI |
分类号 |
B23K20/12;B23K101/14;H01L23/40;H01L23/473;H01L25/11;H05K7/20;(IPC1-7):B23K20/12;B23K31/02 |
主分类号 |
B23K20/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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