发明名称 Spacer formation in a deep trench memory cell
摘要 In a process for manufacturing deep trench memory cells, a method of forming a nitride spacer so as to avoid shorts resulting from poly filling voids in said nitride spacer. The voids occur because of nitride filament overhangs from the nitride pad.
申请公布号 US6589832(B2) 申请公布日期 2003.07.08
申请号 US20020053145 申请日期 2002.01.17
申请人 INFINEON TECHNOLOGIES AG 发明人 JAIPRAKASH V. C.
分类号 H01L21/334;H01L21/8234;H01L21/8242;H01L27/108;(IPC1-7):H01L21/823 主分类号 H01L21/334
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