发明名称 POLYESTER FILM FOR IC CARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a film for an IC card which is excellent in heat resistance and embossing properties and is suitable for being laminated on the surface of a card base material to add a surface protection function. <P>SOLUTION: The polyester film for an IC card is prepared by laminating a copolyester film A having 5 to 45 mol% of a diole component composed of cyclohexanedimethanol on at least one surface of a polyester film B having 75 mol% or more of a dicarboxylic acid component composed of at least one kind of component to be selected from the group consisting of terephthalic acid and naphthalenedicarboxylic acid with its melting point of 190&deg;C or more. <P>COPYRIGHT: (C)2003,JPO
申请公布号 JP2003191419(A) 申请公布日期 2003.07.08
申请号 JP20010399306 申请日期 2001.12.28
申请人 MITSUBISHI POLYESTER FILM COPP 发明人 HIBIYA TAKASHI
分类号 B42D15/10;B32B27/36;G06K19/077 主分类号 B42D15/10
代理机构 代理人
主权项
地址