| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing high-productive and high quality resin-sealed semiconductor device which has outer electrodes projecting to the back side, and a lead frame suited to this manufacturing method. SOLUTION: A large number of semiconductor chips are mounted on a lead frame 4. The lead frame 4 is set in a cavity 14, formed in a lower die 15a of a sealing die and is sealed with resin to improve its productivity. In making resin sealing, a sealing tape 6 is inserted between the die surface of an upper die 15b and the lead frame 4 to form outer electrodes which project from the back side of the seal resin, utilizing the biting in action of signal connecting terminals of the lead frame 4 into the sealing tape 6. Connecting parts between chip-mounting regions Rcp of the lead frame 4 are pressed by press blocks to uniformly adjust the heights of the external electrodes and suppress deformation of the lead frame 4, thereby avoiding wrinkles, etc., on the sealing resin. |
