发明名称 |
METHOD FOR MANUFACTURING FLASH MEMORY |
摘要 |
PURPOSE: A method for manufacturing a flash memory is provided to be capable of preventing residues from being generated at a cell/peripheral boundary region by filling gate forming material into an etching damage groove generated at an isolation layer of the cell/peripheral boundary region when carrying out a gate etching process. CONSTITUTION: An etching damage groove is formed at an isolation layer(42) of a cell/peripheral boundary region while carrying out an oxide layer removing process. A top polysilicon layer(51) and a metal based material layer(52) are sequentially formed on the entire surface of the resultant structure. A gate is formed at a cell region and a peripheral region by carrying out a gate etching process and a self-alignment etching process using a gate mask layer(600). At this time, a dummy gate is formed along the etching damage groove of the cell/peripheral boundary region.
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申请公布号 |
KR20030057895(A) |
申请公布日期 |
2003.07.07 |
申请号 |
KR20010087998 |
申请日期 |
2001.12.29 |
申请人 |
HYNIX SEMICONDUCTOR INC. |
发明人 |
KIM, BONG GIL;KIM, GI JUN;PARK, SEONG GI;SIM, GEUN SU |
分类号 |
H01L29/788;(IPC1-7):H01L29/788 |
主分类号 |
H01L29/788 |
代理机构 |
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代理人 |
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地址 |
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