发明名称 METHOD FOR MANUFACTURING FLASH MEMORY
摘要 PURPOSE: A method for manufacturing a flash memory is provided to be capable of preventing residues from being generated at a cell/peripheral boundary region by filling gate forming material into an etching damage groove generated at an isolation layer of the cell/peripheral boundary region when carrying out a gate etching process. CONSTITUTION: An etching damage groove is formed at an isolation layer(42) of a cell/peripheral boundary region while carrying out an oxide layer removing process. A top polysilicon layer(51) and a metal based material layer(52) are sequentially formed on the entire surface of the resultant structure. A gate is formed at a cell region and a peripheral region by carrying out a gate etching process and a self-alignment etching process using a gate mask layer(600). At this time, a dummy gate is formed along the etching damage groove of the cell/peripheral boundary region.
申请公布号 KR20030057895(A) 申请公布日期 2003.07.07
申请号 KR20010087998 申请日期 2001.12.29
申请人 HYNIX SEMICONDUCTOR INC. 发明人 KIM, BONG GIL;KIM, GI JUN;PARK, SEONG GI;SIM, GEUN SU
分类号 H01L29/788;(IPC1-7):H01L29/788 主分类号 H01L29/788
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