CARRIER HEAD OF CMP APPARATUS

摘要

PURPOSE: A carrier head of a CMP(Chemical Mechanical Polishing) apparatus is provided to reduce largely a damage of a wafer by using a direct vacuum method to absorb the wafer. CONSTITUTION: A carrier head of a CMP apparatus includes a carrier housing(10), a body(20), a wafer support assembly(30), and a loading chamber(40). The carrier housing is driven by a carrier driving shaft. The body is installed and fixed at a center of a lower portion of the carrier housing. The wafer support assembly is arranged at a lower portion of the carrier housing in order to be vertically elevated to an outer surface of the body. A control chamber(33) is formed in the inside of the wafer support assembly. A wafer is absorbed or separated by controlling a pressure of the control chamber. The loading chamber is used for controlling a vertical position of the wafer supply assembly.