| 摘要 |
PURPOSE: A semiconductor chip is provided to be capable of preventing pattern failure at edge portions of die patterns. CONSTITUTION: A semiconductor chip including a memory cell array(100), a test pattern(110) and a scribe line, comprises a plurality of first patterns and a plurality of second patterns. The first patterns are formed at the center portion of the semiconductor chip, and the second patterns are formed at edge portions of the chip. The second patterns have over-size compared to the first patterns. The second patterns further include dummy patterns(101,111) formed at edge portions of the second patterns.
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