发明名称 |
METHOD FOR FABRICATING POLY SILICON TFT |
摘要 |
PURPOSE: A method for fabricating a poly silicon TFT(Thin Film Transistor) is provided to reduce the generation of defects on the surface of a poly silicon layer by activating a catalytic metal material under the atmosphere of nitrogen. CONSTITUTION: A buffer layer(112) is formed on a substrate(100). An amorphous silicon layer is deposited on the entire surface of the buffer layer including the buffer layer. A catalytic metal material is absorbed on an upper portion of the amorphous silicon layer. A poly silicon layer(115) is forming by crystallizing the amorphous silicon layer. The poly silicon layer is stabilized by performing an activation process under the atmosphere of nitrogen. A surface of the stabilized poly silicon layer is etched by using a predetermined material such as HF.
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申请公布号 |
KR20030057655(A) |
申请公布日期 |
2003.07.07 |
申请号 |
KR20010087729 |
申请日期 |
2001.12.29 |
申请人 |
LG.PHILIPS LCD CO., LTD. |
发明人 |
BAE, JONG UK;KIM, BIN;KIM, HAE YEOL |
分类号 |
H01L29/786;(IPC1-7):H01L29/786 |
主分类号 |
H01L29/786 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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