WAXLESS MOUNT POLISHING METHOD AND ITS APPARATUS

摘要

PROBLEM TO BE SOLVED: To provide a waxless mount polishing method of performing polishing corresponding to the thickness of a semiconductor wafer by using a template of a single thickness and its apparatus.

SOLUTION: When the thickness of the silicon wafer W is varied before polishing and varied to a target thickness after the polishing, a spacer S is inserted into and extracted from between a polishing head 12 and a plate fixing member 15 according to the wafer thicknesses having been varied to. Then the height of a template 14 is adjusted. Consequently, polishing corresponding to the thickness of the silicon wafer W can be performed by using the template 14 with the single thickness.

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