| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To efficiently connect a semiconductor element to a sub-mount without leaving thermal strains in the element such as a semiconductor laser chip or the like. <P>SOLUTION: A method for die bonding the semiconductor element comprises the steps of mounting the sub-mount 23 on a pedestal 12. The method further comprises the step of blowing an inert gas from a gas jet nozzle 14 to the sub-mount 23. Further, the method comprises the steps of irradiating the rear surface of the sub-mount 23 with a laser beam 15, and hence preliminarily heating the sub-mount 23. The method also comprises the steps of lowering a capillary 13, and hence mounting a semiconductor laser chip 18 on the sub- mount 23. The method also comprises the steps of then raising the irradiation intensity of the beam 15, and heating the sub-mount 23. Thus, an insert material interposed between the sub-mount 23 and the chip 18 is melted, and the chip 18 is die bonded to the sub-mount 23. <P>COPYRIGHT: (C)2003,JPO</p> |
