| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of manufacturing substrate with built-in element in which a semiconductor chip having electrode pad sections arranged at fine pitches can be connected to a conductor pattern formed on a substrate without changing the pitches of the pad sections, and to provide a substrate with built-in element manufactured by the method. <P>SOLUTION: A laminate 25 obtained by laminating an adhesive sheet 10 having an opening 11 that can house the semiconductor chip 2 upon the resin forming surface of copper foil 20 with resin, and a printed wiring board 3 mounted with the semiconductor chip 2 in a face-up manner are laminated upon each other. Then connecting holes 18 and 19 are formed from the surface of the laminate 25 to the electrode pad sections 6 and a circuit pattern 7 by direct laser beam machining and a conductor layer 5A is electrically connected to the electrode pad sections 6 and circuit pattern 7 by packing a conductive material in the holes 18 and 19, or the like. Thereafter, the electrode pad sections 6 are connected to the circuit pattern 7 by patterning the conductor layer 5A. <P>COPYRIGHT: (C)2003,JPO</p> |
