发明名称 THIN FILM TRANSISTOR SUBSTRATE AND ITS FABRICATING METHOD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a thin film transistor substrate in which interlayer capacitance can be reduced and a stabilized contact is attained by enhancing the step coverage of a conductive film in a contact hole. <P>SOLUTION: The thin film transistor substrate comprises a semiconductor layer 14 provided with a source part 14a and a drain part 14b, an insulation film 16 and a gate electrode 20 formed on the semiconductor layer 14, interlayer insulation films 22 and 24 having different permittivity covering the gate electrode 20, a source part contact hole 25 and a drain part contact hole 25 formed in the interlayer insulation films 22 and 24, a pixel electrode 26 connected with the source part 14a through the source part contact hole 25, a first conductive film 26a formed of the same film as the pixel electrode 26 and connected with the drain part 14b through the drain part contact hole 25, and a second conductive film 28 connected with the drain part 14b through the first conductive film 26a. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003188385(A) 申请公布日期 2003.07.04
申请号 JP20010383930 申请日期 2001.12.18
申请人 FUJITSU DISPLAY TECHNOLOGIES CORP 发明人 HOTTA KAZUE;NAGAHIRO NORIO;SATO KIYOTAKE;WATABE TAKUYA;YAEGASHI HIROYUKI
分类号 G02F1/1368;G02F1/136;H01L21/265;H01L21/3205;H01L21/336;H01L21/77;H01L21/84;H01L23/52;H01L27/12;H01L29/423;H01L29/43;H01L29/49;H01L29/786;(IPC1-7):H01L29/786;H01L21/320 主分类号 G02F1/1368
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