发明名称 APPARATUS AND METHOD FOR PROCESSING SUBSTRATE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an apparatus and a method for processing a substrate capable of preventing unevenness of processing of the substrate. <P>SOLUTION: In the apparatus for processing the substrate, the substrate W is held at its periphery by a plurality of holding members 80, and the substrate W is rotated and processed. The holding members 80 abut against the different locations of the periphery of the substrate W, according to the rotating direction CW, CCW of the substrate W. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003188244(A) 申请公布日期 2003.07.04
申请号 JP20010382920 申请日期 2001.12.17
申请人 TOKYO ELECTRON LTD 发明人 TOSHIMA TAKAYUKI;AMAI MASARU
分类号 B08B3/02;B05B13/02;H01L21/027;H01L21/304;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 B08B3/02
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