| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a wafer support which enables suppression of generation of slips, caused by the shift at the contacting surface with the support tool body due to the warpage of the wafer as a result of heating at heat treatment. <P>SOLUTION: This wafer support relates to improvement in the wafer support on the upper surface of which a wafer is placed for heat treatment, having a discoid support body 22 and a projections 23 either ring-shaped or with one or more than two separate arc-like projections on the discoid support body, extending in the circumferential direction with the center of an axis line 22a and protruding upwardly. The projection comprises a flat surface 24 and a first inclined surface 27, which is inclined downward from the flat surface 24 to an axis line and is also connected to a non-projecting surface 26 of the support body 27. The wafer support should have a first roundness 28, connecting the flat surface and the first inclined surface at the crossing portion of the flat surface and the first inclined surface, and an average surface roughness Ra<SB>0</SB>of the flat surface and an average surface roughness Ra<SB>1</SB>ranges 0.01 to 10μm each. <P>COPYRIGHT: (C)2003,JPO</p> |
