| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a wiring board which realizes the wiring of high density without the occurrence of discontinuity in a through conductor. SOLUTION: A process for bonding inner layer conductors 2A and 2B formed of copper foil on the upper and lower faces of an insulating resin board 1 and forming opening 8 whose diameter is 30 to 100μin the inner layer conductors 2A and 2B, a process for bonding insulating resin layers 3A and 3B to the insulating resin board 1, a process for irradiating laser beams from the outer side of the opening part 8 and forming a through hole 4 which vertically passes through the insulating resin layers 3A and 3B, the inner layer conductors 2A and 2B and the insulating resin board 1 and whose diameter is 75 to 130μm, a process for bonding a through conductor 5 to the inner wall of the through hole 4 and surface layer conductors 6A and 6B to the surfaces of the insulating resin layers 3A and 3B by copper plating, and a process for filling or coating the inner wall of the through hole 4 and the surface of the insulating resin layers 3A and 3B with the uncured resin of the same composition, curing resin and integrally forming a resin pole 7a where resin is cured in the through hole 4 and a solder resist layer 7b where resin is cured on the surfaces of the insulating resin layers 3A and 3B, are sequentially performed. COPYRIGHT: (C)2003,JPO |
