| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow soldering device which can securely perform reflow soldering by using lead-free solder whose boiling point is high without damaging the heat resistance of an electronic part mounted on a board. SOLUTION: The soldering device is provided with a reflow heating means 14 for heating the lower face of the board 12a where the electronic part 12b is mounted on an upper face, and for reflow-soldering the electronic part 12b on the board 12a; and a part temperature rise suppressing means 15 for causing cooling air for electronic part cooling along the upper face of the board 12a. The electronic part 12b mounted on the upper face of the board 12a is compulsorily cooled with the cooling air of the part temperature rise suppressing means 15, and the reflow heating means 14 heats the lower face of the board 12a to a high temperature. Thus, a sufficient temperature difference can be secured between the main body and the leads of the electronic part 12b. Reflow soldering with lead-free solder of the high boiling point can be performed without damaging the heat resistance of the electronic part 12b. COPYRIGHT: (C)2003,JPO |
