| 摘要 |
PROBLEM TO BE SOLVED: To prevent the drop of the operation of a reflow furnace. SOLUTION: Multiple types of packaging plates 3 different in heat capacity are prepared. The packaging plate 3 having heat capacity suitable for a substrate 2 of the object of reflow and for used solder is selected from the multiple types of packaging plates 3. The substrate 2 of the object of reflow is mounted on the selected packaging plate 3 and it is made to pass through the reflow furnace. When the substrate 2 of the object of reflow is switched to another type of substrates 2 different in a specification form, the packaging plate 3 having heat capacity adjusted to the switched substrate 2 is selected. The switched substrate 2 of the object of reflow is mounted on the switched substrate 2 of the object of reflow and it is made to pass through the reflow furnace. Even if the type of the substrate 2 of the object of reflow is switched, the heat damage to a part 1 and the packaging defect of the part 1 are prevented, and the part 1 can be packaged on the substrate of the switched type while the temperature in the reflow furnace is maintained almost the same. COPYRIGHT: (C)2003,JPO |
