发明名称 JET FLOW SOLDER TANK
摘要 PROBLEM TO BE SOLVED: To provide a small sized jet flow solder tank at a low cost, capable of supplying solder to a plurality of jet flow nozzles with one supply section and one driving section. SOLUTION: A jet flow solder tank 1 comprises at least a solder tank body 2, a plurality of jet flow nozzles 3, 8 disposed in the solder tank body 2 for jetting the molten solder, a supply section 4 for supplying the molten solder to the jet flow nozzles, and a driving section 5 for driving the supply section 4. The supply section is one, and a piping 6 is provided for distributing and supplying the molten solder from the supply section to a plurality of the jet flow nozzles 3, 8, and further a valve 7 is provided on the piping 6 for changing the jet flow nozzles 3, 8 to which the molten solder is supplied. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003188519(A) 申请公布日期 2003.07.04
申请号 JP20010381715 申请日期 2001.12.14
申请人 DENSO CORP 发明人 MINEZAKI MASAHITO;TAKEDA TAKANORI
分类号 B23K1/08;B23K101/42;H05K3/34;(IPC1-7):H05K3/34 主分类号 B23K1/08
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