发明名称 SHEET FOR BORING PRINTED WIRING BOARD AND METHOD OF BORING PRINTED WIRING BOARD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a sheet for boring printed wiring board that is excellent in boring position accuracy and plating covering power at the time of boring a printed wiring board, and to provide a method of boring printed wiring board using the sheet. SOLUTION: The sheet for boring printed wiring board is composed of a resin composition layer containing a water-soluble polyoxyalkylene compound (A) having a weight-average molecular weight of≥10,000, and another polyoxyalkylene compound (B) having a weight-average molecular weight of 300-10,000 or a laminated layer of the resin composition layer and a substrate, and the resin composition layer is satin-finished. At the time of boring a through hole through the printed wiring board, the sheet is used. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003188490(A) 申请公布日期 2003.07.04
申请号 JP20010383983 申请日期 2001.12.18
申请人 NIPPON SYNTHETIC CHEM IND CO LTD:THE;SHINETSU FUJITSU KK 发明人 IZUMI TSUKASA;TAKASHI HIROSHI
分类号 H05K3/00;(IPC1-7):H05K3/00 主分类号 H05K3/00
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