METHOD OF MANUFACTURING ELECTRONIC PACKAGE

摘要

PROBLEM TO BE SOLVED: To solve the problem that initial resistance may vary greatly and sufficient connecting reliability may not be ensured in electronic components packaging using a conductive adhesive. SOLUTION: Ultrasonic wave is applied to the portions of the conductive adhesive 3 before or when the conductive adhesive 3 cures. This enables increasing the filling density of conductive fillers and improving the contact probability of the conductive fillers. COPYRIGHT: (C)2003,JPO