| 摘要 |
PURPOSE: A chip bonding device of an FPD(Flat Panel Display) and the bonding method thereof are provided to increase the efficiency and the productivity of a process by improving the bonding accuracy and reducing the operating time. CONSTITUTION: A chip bonding device contains a worktable, a rotating device(R), a loading portion(16), a cleaning portion(18), a chip setting portion(20), a bonding portion(22) and an unloading portion(24). The rotating device is installed on the worktable and moves a loaded glass. The loading portion is installed in the circumferential direction of the rotating device. The bonding portion comprises more than two bonding units(B1,B2). The bonding unit comprises a fixing plate(40), a horizontal plate(42), a vertical plate(44) and a bonding head. The fixing plate is installed in an upper plate(4) of the worktable. The horizontal plate is moved leftward and rightward by combining with a slide member to be horizontally installed in the fixing plate. The vertical plate is moved upward and downward by combining with a slide member to be vertically installed in the horizontal plate. The bonding head bonds a chip while moving at the same direction as the vertical plate by combining with the vertical plate. A heater is inserted in the bonding head. A pressure detecting member is installed between the bonding head and the vertical plate. Thereby, the adhesive strength of the chip is improved and the improved bonding accuracy is maintained.
|
