| 摘要 |
PROBLEM TO BE SOLVED: To reduce bad products produced by scattering of a solvent for solder, and hence reduce works such as an inspection for the total produced printed boards and the correction for a scattered portion by manual work. SOLUTION: When a cylinder 17 pulls in a rod upon a conveyance mechanism 6 is interrupted, a guide rod 20 lowers guided by a guide 19, whereby a cover mounting structure 21 is lowered, and a cover 16 provided, corresponding to a printed board 4, on a lower surface of the cover mounting structure 21 covers a land 4A on the printed board 4. Namely, the cover 16 having the size to cover a hatched area S1 including the land 4A on each printed board 4 covers a portion on the printed board 4 liable to be influenced, i.e., the land 4A upon the interruption of conveyance by the conveyance mechanism 6 even when the solder 10 is melted with a heater block 5 and a solvent is scattered. COPYRIGHT: (C)2003,JPO
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