POWER AMPLIFIER MODULE AND SUBSTRATE FOR THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a power amplifier module that is excellent in heat dissipation property and can be prevented effectively from dropping in output or efficiency even when the on resistance of a semiconductor chip increases, and to provide a substrate used for the module. SOLUTION: The substrate 7 contains thermal via holes 5. The via holes 5 are provided in the thickness direction of the substrate 7 and contain heat sinks 6. The heat sinks 6 contain plated films 61. The films 61 are adhered to the internal surfaces of the via holes 5. The semiconductor chip 20 is mounted on the substrate 7 in the forming area of the thermal via holes 5 and thermally coupled with the heat sinks 6. COPYRIGHT: (C)2003,JPO