| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer-inspecting apparatus and a wafer-inspecting method that perform quality decision tests for deciding the acceptance and rejection of semiconductor chips, and a characteristic measurement test for checking more detailed electrical characteristics in the same wafer inspection apparatus. SOLUTION: A wafer control host 1 has a test condition database 3, that stores test conditions including information on the quality decision test program for a semiconductor chip, information on a specific characteristic value and a characteristic measurement test program for measurement, and information on a chip address for carrying out a characteristic measurement test. A tester 2 receives testing conditions, and tests the semiconductor chip on a wafer via a probe 6, according to the accept/reject test program. Additionally, the tester 2 changes a program to the characteristic measurement test program after the accept/reject decisions of all semiconductor chips on the wafer, and measures the concrete characteristic value of the semiconductor chip of a chip address, that is specified by the test conditions. The characteristics values are accumulated in a characteristics database 5. COPYRIGHT: (C)2003,JPO
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