EPOXY MOLDING COMPOUND COMPOSITION HAVING EXCELLENT CRACKING RESISTANCE AT HIGH TEMPERATURE

摘要

PURPOSE: Provided is an epoxy molding compound composition having excellent flexural properties and cracking resistance at a high temperature of 230 deg.C or more. CONSTITUTION: The epoxy molding compound composition comprises 12 to 13 wt% of an epoxy resin, 6 to 7 wt% of a curing agent, 0.2 to 0.3 wt% of a curing accelerator, 0.6 to 0.7 wt% of other conventional additives, 75 to 85 wt% of an inorganic filler and 0.2 to 1.5 wt% of a nano-particle co-filler. Preferably, the nano-particle co-filler is nanosilicate, nanosilica or a mixture thereof.