| 摘要 |
PURPOSE: A polishing head of a CMP(Chemical Mechanical Polishing) apparatus is provided to improve the polishing uniformity by forming a projection portion corresponding to a flat zone portion of a wafer on an elastic member. CONSTITUTION: A polishing head of a CMP apparatus includes a housing(110), a carrier(120), a wafer chuck(130), and an elastic member(132). The housing includes air flow path to guide the flow of air. The carrier is connected to the housing. The wafer chuck includes a plurality of through-holes(114a-114c) connected to the air flow path in order to absorb a wafer(W) by using a vacuum pressure provided through the air flow path. The wafer chuck is mounted on the carrier. The elastic member is installed at a bottom portion of the wafer chuck in order to absorb the wafer. A projection portion(132a) is formed at one side of the elastic member.
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