Low pressure pyrolysis process, used e.g. in the fabrication of electronic devices on semiconductor wafers, involves passing a reactive gas at low pressure into a container and forming a reactive gas plasma at container outlet

摘要

Low pressure pyrolysis process used generally in industry and applicable in the fabrication of electronic devices on semiconductor wafers involves passing a reactive gas at low pressure into a container (21) and forming a reactive gas plasma at the outlet of the container. Preferred Features: The reactive gas is oxygen and the element to be pyrolyzed is a photosensitive resin. An Independent claim is given for an installation used for implementation of the photosensitive resin. The installation comprises a heated container (21) through which a reactive gas passes. A series of conductive grids (2) are located at the outlet of the container for forming the reactive gas plasma. The grids (22) are excited at high voltage and high frequency by a generator (23), and they can be located inside the container (21) or located in a chamber located immediately downstream from the container.