发明名称 RESIN CURING INDUCTION HEATING DEVICE AND RESIN CURING METHOD BY INDUCTION HEATING
摘要 PROBLEM TO BE SOLVED: To provide a resin curing method by induction heating in which, by using a heating method by high frequency induction heating, the working environment, productivity, and maintenance are superior, and efficient heating and cooling can be obtained. SOLUTION: The cylindrical protruded part 32 that is provided in a first resin molding 31 is penetrated in a hole 34 provided in a second resin molding 33, and the cylindrical protruded part 32 protruding portion penetrated in the hole 34 is melted by high frequency induction heating of a die 14 and deformed so as to expand outside, and then, by cooling, the second resin molding 33 is fastened to the first resin molding 31. COPYRIGHT: (C)2003,JPO
申请公布号 JP2003187949(A) 申请公布日期 2003.07.04
申请号 JP20010384768 申请日期 2001.12.18
申请人 FUJI DENPA KOKI KK 发明人 YOSHIDA MUTSUMI;SESHIMO HIROSHI;OKAMOTO TOSHIO
分类号 H05B6/10;H05B6/38;(IPC1-7):H05B6/10 主分类号 H05B6/10
代理机构 代理人
主权项
地址