| 摘要 |
PURPOSE: A method for forming a metal line is provided to be capable of removing an organic layer by decreasing the pressure of Ar plasma in a chamber and irradiating UV(Ultra Violet) rays onto the organic layer generated after a sputtering process using an excimer laser. CONSTITUTION: A sputtering process is carried out for depositing a metal layer(320) on a substrate(300). At this time, an organic layer is generated on the metal layer. The pressure of Ar plasma is conserved less than 0.8 Pa under the sputtering process. UV(Ultra Violet) rays are irradiated onto the resultant structure by using an excimer laser. Then, a photoresist layer(330) is coated on the resultant structure. Preferably, the UV(Ultra Violet) rays are capable of being irradiated at any time after the sputtering process.
|
