| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that can be manufactured easily and provided with external electrodes capable of easily, surely, and electrically connecting semiconductor devices to each other when the semiconductor devices are mounted three-dimensionally. <P>SOLUTION: A plurality of projected electrodes 5 are formed on a wiring pattern formed on the surface 1a of a substrate 1 so that their centers may become coincident with the cutting lines 6 of the substrate 1 (electrode forming step). Then a plurality of semiconductor chips 2 is face-down bonded to the surface 1a of the substrate 1. Consequently, the chips 2 are electrically connected to the projected electrodes 5 through the wiring pattern (semiconductor chip bonding step). In addition, the chips 2 and electrodes 2 are collectively sealed with resin 2 (resin sealing step). Thereafter, semiconductor devices 10 are manufactured by cutting the resin 2, projected electrodes 5, and substrate 1 along the cutting lines 6 (cutting step). The cut surfaces of the projected electrodes 5 exposed on the end faces of each semiconductor device 10 become the external electrodes 4. <P>COPYRIGHT: (C)2003,JPO</p> |
