摘要 |
PURPOSE: A one form trim apparatus is provided to be capable of reducing total process time by simultaneously carrying out a form process and a trim process using a lead cutter and a cam. CONSTITUTION: A one form trim apparatus is provided with a lead cutter(10) capable of cutting a lead frame(61) of a semiconductor package(60), a cam guide(30) having a pair of rollers(31) installed at the lower portion of the lead cutter, a cam form pad(50) connected to the back side of the cam guide for protecting the semiconductor package, a cam punch(40) for forming the lead frame of the semiconductor package into an aiming shape, and a cam form die(70) installed at the lower portion of the cam form pad. Preferably, the lead cutter includes a protruded part(11) and a spring(20) connected with the protruded part. Preferably, the cam guide includes a connecting hole(32) corresponding to the spring.
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