发明名称 MEMORY MODULE SOCKET
摘要 PURPOSE: A memory module socket is provided to reduce abrasion of a contact pad and contact part using a streamlined contact pin and allow the contact pad and contact part to come into contact with each other smoothly according to elastic force of the contact pin. CONSTITUTION: A memory module socket(42) has a housing having a groove(44) into which a memory module is inserted and from which the memory module is separated. A plurality of contact pins(40) are included in the groove. The contact pins are electrically connected with a plurality of contact pads of the memory module, respectively. The plurality of contact pins easily comes into contact with the contact pads according to its elasticity when the memory module is inserted into the groove. Each of the contact pins has a streamline shape and made of BeCu.
申请公布号 KR20030057212(A) 申请公布日期 2003.07.04
申请号 KR20010087601 申请日期 2001.12.28
申请人 HYNIX SEMICONDUCTOR INC. 发明人 KIM, GYEONG HWA
分类号 H01R33/76;(IPC1-7):H01R33/76 主分类号 H01R33/76
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