MULTI-CHIP MOUNTED SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A multi-chip mounted semiconductor package is provided to be capable of minimizing the size of the semiconductor package and improving the degree of integration by improving the structure of the semiconductor package. CONSTITUTION: A semiconductor package is provided with a heat sink(10) for mounting a plurality of semiconductor chips(21,22), an epoxy part(25) for easily mounting the semiconductor chips on the heat sink, a molding part(30) for enclosing and protecting the semiconductor chips, a plurality of wires(26) for being capable of transferring the electric signal of the semiconductor chips to the outside through a lead(11), a plurality of bumps(12) attached on the back side of the bottommost semiconductor chip and solder balls(31). Preferably, a nonconducting tape(13) is connected between the lead and the heat sink.