发明名称 ELECTROSTATIC CHUCK
摘要 PURPOSE: An electrostatic chuck is provided to prevent the thermal expansion of a wafer and reduce the generation of particles by using a silicon rubber. CONSTITUTION: An electrostatic chuck includes a main body(10), a base coating portion(20), an electrode portion(30), an over-coating portion(40), and a wafer chucking portion(50). The main body is installed in the inside of a process chamber. The main body is formed with a graphite material. The base coating portion is formed with PBN(Pyrolytic Boron Nitride) in order to cover an outer surface of the main body. The electrode portion is formed by depositing and patterning PG(Pyrolytic Graphite) on a surface of an upper side of the base coating portion. The over coating portion is formed by depositing the PBN on a lower portion of the electrode portion and an outer surface of the base coating portion. The wafer chucking portion is adhered on an upper portion of the patterned electrode portion.
申请公布号 KR20030055662(A) 申请公布日期 2003.07.04
申请号 KR20010085706 申请日期 2001.12.27
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 HUH, SAM SEONG;KANG, GYEONG HO;KIM, TAE HUN
分类号 H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/68
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